The demand for AI servers and high-performance computing (HPC) is causing shortages of raw materials and price pressures in the supply chain of printed circuit boards (PCBs) and IC substrates in Taiwan. CCL prices have increased by approximately 20-30% in the first half of the year, and this trend may continue from the second half of 2026 to 2027. The supply shortage rate for second-generation low-dielectric glass fiber cloth exceeds 60%, and the shortage of T-Glass is also expanding. High-spec substrates for AI servers have higher CCL specifications and usage than consumer electronics, meaning changes in raw material prices have a greater impact on manufacturing costs. CCL is a fundamental material for circuit boards, and PP is used when bonding multiple substrate layers. Despite the increase in demand for high-spec PCBs, it is difficult to immediately increase the supply of materials. Taiwan's Zhen Ding has reflected CCL costs in product prices, while Jingfeng has passed on 70-80% of the cost burden to customers. Dingying Holdings reported a gross profit margin of 14.02% in the second quarter, and Yao Hua has completed price increase negotiations. In the IC substrate sector, companies such as Xinxing, Jingshuo, and Nanya have been mentioned, with the packaging demand for AI GPUs and ASICs increasing the demand for high-spec IC substrates. This issue demonstrates that the expansion of AI infrastructure is exerting cost pressures on raw materials, substrates, and equipment.
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